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Principal Structural Engineer: Electronics Packaging for Space Systems

Northrop Grumman

Dulles, VA 20164
  • Engineering
  • Manufacturing / Production
Northrop Grumman
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Job Details

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Space designs, builds and delivers space, defense and aviation-related systems to customers around the world. Our main products include launch vehicles and related propulsion systems; missile products, subsystems and defense electronics; precision weapons, armament systems and ammunition; satellites and associated space components and services; and advanced aerospace structures.

Job Summary:
In this role you will:
- Perform thermal and structural vibration analyses of electronic hardware designs using FEA based software tools
-Determine component temperatures for a variety of environments and assess random vibration fatigue life
-Recommend electronic packaging design improvements based on the results of analysis
-Support environmental test programs

-Support Manufacturing to resolve production issues related to electronics hardware
-Support project system and design teams
-Support project team meetings and reviews, with a high degree of personal and professional responsibility
-Support continuous refinement and improvement of development methodologies and processes
-Interface with Project Managers, Project Element Managers, Task Managers, and Mission Assurance Managers to develop appropriate thermal engineering requirements and plans for Space Projects


**Basic Qualifications:**
Requires a Bachelor of Science degree in a STEM field (ideally Mechanical Engineering, Aeronautical Engineering, or Physics)
5+ years of experience, ideally in structural or thermal analysis and/or testing of electronic assemblies both at the board level and at the chassis level (or 3 yrs. with a Masters or PhD)
Experience with **FEMAP**
**Familiar with IPC or NASA standards** for circuit card assembly and Printed Wiring Board (PWB) design and fabrication
A **background in vibration, shock, and thermal testing** of space based electronic assemblies

**Preferred Qualifications:**
A background in electronics packaging engineering
Ability to perform thermal and structural engineering tasks associated with analysis, design, and testing of electronics structures and circuit card assemblies
Excellent computer skills, including and use of computer-aided engineering tools
Excellent verbal and written communication skills, including being fluent using the full Microsoft Office suite of software
The ability to work with multiple interfaces
Experience with Creo Parametric or equivalent 3D modeling software.
Experience with Mechanical Analysis using NX FEMAP/NASTRAN.
Experience with thermal analysis and tools such as Solaria Thermal, Ansys TAS or equivalent.

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit U.S. Citizenship is required for most positions.

**Job Category** : Engineering
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